Method of manufacturing light source device

ABSTRACT

A method of manufacturing a light source device includes: providing a substrate having a plurality of light sources disposed thereon; causing the plurality of light sources to emit light; measuring a first light-intensity distribution of an entire surface that is in parallel to the substrate and located above the plurality of light sources; and based on a measured value of the first light-intensity distribution, forming a light-reflecting pattern above the plurality of light sources to obtain a second light-intensity distribution that is different from the first light-intensity distribution.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

The present application claims priority under 35 U.S.C. § 119 toJapanese Patent Application No. 2018-074008, filed Apr. 6, 2018. Thecontents of Japanese Patent Application No. 2018-074008 are incorporatedherein by reference in their entirety.

BACKGROUND Technical Field

The present disclosure relates to a method of manufacturing a lightsource device.

Description of Related Art

Light source devices of surface-emission type, in which a plurality oflight emitting elements are arranged in a matrix, alternate rows, or thelike, have been proposed, for example, in Japanese Unexamined PatentApplication Publication No. 2008-27886.

SUMMARY

Various attempts have been made to obtain a uniform spatial distributionof light emitted from such light source devices of surface-emissiontype. However, when such a plurality of light emitting elements areassembled into a light source device, reduction in an uneven spatialdistribution of light within the entire light-emitting surface may belimited to some degree due to individual differences in members or acombination thereof used for, for example, wavelength converting,diffusing, absorbing, and/or transmitting, of light emitted from lightemitting elements, or to individual differences of the light emittingelements. Individual differences in the light emitting elements and/ormembers used therein used in a single light source device are alsodifficult to prevent, which may also attribute to the difficulty inobtaining a uniform spatial distribution of light within the entirelight-emitting surface.

A method of manufacturing a light source device according to the presentdisclosure includes: providing a substrate having a plurality of lightsources disposed thereon; causing the plurality of light sources to emitlight; measuring a first light-intensity distribution of an entiresurface that is in parallel to the substrate and located above theplurality of light sources; and based on a measured value of the firstlight-intensity distribution, forming a light-reflecting pattern abovethe plurality of light sources to obtain a second light-intensitydistribution that is different from the first light-intensitydistribution.

The method of manufacturing a light source device described above canrealize, through simpler procedure, more uniform distribution of lightwithin a light-emitting plane of a surface-emission type light sourcedevice having a plurality of light emitting elements arranged in amatrix or in alternate rows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart illustrating a method of manufacturing a lightemitting device according to one embodiment of the present invention.

FIGS. 2A to 2E are schematic cross-sectional views illustrating a methodof manufacturing the optical component according to one embodiment ofthe present invention.

FIG. 3A is a schematic cross-sectional view showing a light source usedin the method of manufacturing a light emitting device according to oneembodiment of the present invention.

FIG. 3B is a graph showing light distribution characteristics of thelight source shown in FIG. 3A.

FIG. 4A is a plan view showing one example of a substrate, the firstlight-intensity distribution thereof to be measured in the method ofmanufacturing a light emitting device according to the presentinvention.

FIG. 4B is a plan view showing one example of a light-reflecting patternformed in the method of manufacturing a light source according to thepresent invention.

FIG. 5A is a graph showing light distribution characteristics of a lightemitting device that has the light-reflecting pattern formed in themethod of manufacturing a light source according to the presentinvention.

FIG. 5B is a graph showing light distribution characteristics of a lightemitting device according to a comparative example, which does not havethe light-reflecting pattern.

FIG. 6 is a schematic cross-sectional view showing one example of alight emitting device obtained according to the present invention.

FIG. 7 is a plan view showing another example of light-reflectingpattern formed in the method of manufacturing a light source accordingto the present invention.

FIG. 8 is a plan view showing still another example of light-reflectingpattern formed in the method of manufacturing a light source accordingto the present invention.

FIG. 9 is a plan view showing still another example of light-reflectingpattern formed in the method of manufacturing a light source accordingto the present invention.

FIG. 10 is a plan view showing still another example of light-reflectingpattern formed in the method of manufacturing a light source accordingto the present invention.

FIG. 11 is a plan view showing still another example of light-reflectingpattern formed in the method of manufacturing a light source accordingto the present invention.

FIG. 12 is a schematic cross-sectional view showing one example of alight emitting device obtained according to the present invention.

FIG. 13 is a schematic cross-sectional view showing one example of alight emitting device obtained according to the present invention.

DESCRIPTION OF THE EMBODIMENTS

Certain embodiments according to the present disclosure will bedescribed below with reference to the accompanying drawings. It is to benoted that the light emitting device described below is intended forimplementing the technical concept of the present invention, and thepresent invention is not limited to those described below unlessotherwise specified. Description given in one example and one embodimentcan also be applied in other examples embodiments of embodiments. Notethat, the size, positional relationship and the like in the drawings maybe exaggerated for the sake of clarity.

A method of manufacturing a light source device includes, for example,as shown in FIG. 1, providing a substrate having a plurality of lightsources disposed thereon (S1), causing the plurality of light sources toemit light and measuring a first light-intensity distribution (S2, S3),and based on a measured value of the first light-intensity distribution,forming a light-reflecting pattern (S4) to obtain a secondlight-intensity distribution that is different from the first-lightintensity distribution.

The method allows for more uniform distribution of light within alight-emitting surface of a surface-emission type light source devicehaving a plurality of light emitting elements arranged, for example, ina matrix or in alternate rows, through a simpler and more reliablemethod of measuring a light-intensity distribution and adjustingaccordingly the plurality of light emitting elements disposed on thesubstrate or an assembled state thereof, even in the presence ofvariation in the light emitting elements, or in the presence ofvariation in respective members or combinations of the members used forwavelength conversion, diffusion, absorption, reflection, transmission,or the like of light emitted from the light emitting element whenassembled into a light source device. The use of the method allows foruniform light intensity distribution within the light-emitting surfaceof individual light sources, and further allows for measuring andadjusting the in-plane light-intensity distribution for each lightsource device. Accordingly, manufacturing of high quality light sourcedevices can be realized.

Providing Substrate

A plurality of light sources and a substrate on which the plurality oflight emitting devices to be arranged are provided.

Substrate 10

The substrate 10 is to support a plurality of light sources, and theshape, material, or the like can be appropriately selected. For example,as shown in FIG. 2A, a base member 11 having a plate-like shape and aflat upper surface is preferably used for the substrate 10, with anelectrically conductive wiring layer 12 being preferably disposed on asurface (hereinafter may be referred to as an upper surface 11 a) wherethe light sources are to be disposed. The material of the base member 11can be appropriately selected from electrically insulating materials,electrically conductive materials, and composite materials of those. Forexample, the material of the base member 11 can be selected from resins,ceramics, or the like. In view of low cost and ease of molding, resin ispreferably used. Examples of the resin include phenol resin, epoxyresin, polyimide resin, BT resin, polyphthalamide (PPA), polyethyleneterephthalate (PET), urethane resin, acrylic resin, polycarbonate resin,oxetane resin, silicone resin, and modified silicone resin. A resinmaterial having a light-reflecting material made of oxide particles suchas titanium oxide, aluminum oxide, or silicon oxide dispersed thereinmay be used. With the use of such materials, light from the light sourcecan be reflected on the upper surface of the substrate, and leakage andabsorption of light at the substrate side can be prevented or reduced,and accordingly, the light extraction efficiency of the light emittingdevice can be improved. Because of good heat-resisting properties andgood light-resisting properties, ceramics may be used. Examples ofceramics include alumina, mullite, forsterite, glass ceramics,nitride-based ceramics (for example, AN), carbide-based ceramics (forexample, SiC), and LTCC. Examples of composite materials include theresins described above having an inorganic filler such as glass fiber,SiO₂, TiO₂, or Al₂O₃ mixed therein, and glass fiber reinforced resin(glass epoxy resin). Accordingly, an improvement in the mechanicalstrength, a reduction in the thermal expansion coefficient, animprovement in the optical reflectance, etc., of the base member 11 canbe achieved. The base member 11 may have a layered structure.

Electrically Conductive Wiring Layer 12

The electrically conductive wiring layer 12 has a wiring patternconfigured to supply electric power from the outside to each of thelight sources. The material of the electrically conductive wiring layer12 is such that if a ceramics material is used for the base member 11, ahigh melting temperature metal that can be calcined with the ceramicsmaterial of the base member 11 is preferably used. For example, a highmelting temperature metal such as tungsten, molybdenum, or the like canbe used. If a glass epoxy material is used for the base member 11, amaterial offering ease of processing is preferably used for theelectrically conductive wiring layer 12. For example, copper, nickel, orthe like may be applied by plating, sputtering, vapor deposition,press-bonding, or the like. The electrically conductive wiring layer 12may include a multilayer film. For example, the electrically conductivewiring layer 12 may include a pattern made of a high melting temperaturemetal formed using a technique as described above, and a metal layercontaining one or more other metals such as nickel, gold, and silver,deposited on the pattern by plating, sputtering, vapor deposition, orthe like.

A light-reflecting electrically insulating layer is preferably disposedon the electrically conductive wiring layer 12. Examples of thelight-reflecting material include the materials similar to thoseillustrated for the base member 11. Further, a metal layer may bedisposed on a lower surface 11 b of the base member 11. The metal layermay be disposed, for example, on an entire lower surface 11 b of thebase member

Wall Part 13

The substrate 10 may further includes wall parts 13 surrounding each ofthe plurality of light sources. The wall parts 13 are configured toreflect light emitted from corresponding light sources such that thelight can be emitted upward. The wall parts 13 surrounding each of theplurality of light sources may extend normal to the upper surface of thesubstrate 10, but as shown in FIG. 2A, the wall parts 13 are preferablysuch that each of the wall parts 13 is slanted outwardly (i.e., awayfrom the corresponding light source) from the upper surface of thesubstrate 10. The wall parts 13 may be formed with a material similar tothat of the base member 11, and the light-reflecting material describedabove may be contained in the wall parts 13 or disposed on the surfacesof the wall parts 13. In particular, the wall parts 13 preferablycontain the light-reflecting material, and more preferably, the wallparts 13 are formed with a material that can reflect 70% or greaterlight emitted from corresponding light sources. Each of the regiondemarcated by the wall parts 13 preferably has a polygonal shape in planview. This can facilitate demarcating the light-emitting area by thewall parts 13 into a desired number, which is appropriate for the planardimensions of the light-emitting surface of the surface light-emittingdevice. Examples of such a polygonal shape include a square shape, arectangular shape, and a hexagonal shape. The wall parts 13 can beformed by using, for example, a die molding method or an optical moldingmethod. Examples of die molding methods include injection molding,extrusion molding, compression molding, vacuum forming, pressureforming, and press forming. For example, as shown in FIG. 4A, the wallparts 13 are preferably disposed along a x-direction and a y directionsuch that each of the enclosed regions for disposing the light source 20has a quadrangular shape. As shown in FIGS. 2A-2E, the wall parts 13have two slopes with a triangular cross-section. The wall parts 13 mayhave a height of, for example, 8.0 mm or less. In a light emittingdevice of a thinner-type, the wall parts 13 may have a height in a rangeof about 1.0 mm to about 4.0 mm.

Light Source 20

The light sources 20 are members configured to emit light, and include,for example, light emitting elements that are configured to producelight, light emitting element(s) enclosed by a light-transmissive resinor the like, and a packaged surface-mounting type light emitting device.

Each of the light sources 20 includes a light emitting element 21 havinga light-emitting surface. For the light emitting element 21, a knownsemiconductor light emitting element such as a semiconductor laserelement, a light emitting diode, or the like can be employed. The lightemitting element 21 includes, for example, a semiconductor layeredstructure. The semiconductor layered structure may include an activelayer and an n-type semiconductor layer and a p-type semiconductor layerinterposing the active layer. An n-side electrode is electricallyconnected to the n-type semiconductor layer and a p-side electrode iselectrically connected to the p-type semiconductor layer. The n-sideelectrode and the p-side electrode may be provided on a surface oppositeto the light emitting surface of the light emitting element 21. For thelight emitting element 21, a semiconductor light emitting element toemit light of a predetermined wavelength can be selected. For example,for a blue light emitting element and a green light emitting element, alight emitting element utilizing ZnSe, a nitride-based semiconductor(In_(X)Al_(Y)Ga_(1-X-Y)N, 0≤X, 0≤Y, X+Y≤1), or GaP can be used. Forexample, for a red light-emitting element, a light emitting elementhaving a semiconductor such as GaAlAs, AlInGaP, or the like can be used.Semiconductor light emitting elements made of materials other than thosedescribed above may also be used. The emission wavelengths of the lightemitting elements 21 can be variously determined by the materials andmixed crystal ratio of the semiconductor layer. The composition,emission color, dimensions, number, or the like of the light emittingelement can be appropriately selected according to intended usage.

The light source 20 configured to emit, for example, blue light or whitelight can be used. When the light source is configured to emit whitelight, the light emitting element 21 to emit white light may beemployed, or light emitted from the light emitting element 21 isconverted into white light by passing through a covering member 24 to bedescribed later below. The number and type of the light emittingelements included in each of the light source 20 may be either one orplural. For example, the light source 20 configured to emit white lightmay include one or more light emitting elements each having three lightemitting parts configured to emit red light, blue light, and greenlight, respectively, or may include three light emitting elementsconfigured to emit red light, blue light, and green light, respectively,such that red light, blue light, and green light are mixed to producewhite light. The light source 20 may include a light emitting element toemit white light and a light emitting element to emit white light and alight emitting element to emit light of other color. The color renderingproperties of light emitted from the light source 20 can be improvedwith the use of a light emitting element to emit white light and a lightemitting element to emit light of other color.

The light source 20 of any appropriate light distributing properties canbe employed, but for example, when the light source 20 is surrounded bythe wall parts 13 on the substrate 10, the light source 20 preferablyhas a wide light distribution such that emission of light with a smalldifference in brightness can be achieved at each region surrounded bythe wall parts 13. In particular, each of the light source 20 preferablyproduce a batwing light distribution. This allows for a reduction in theamount of light emitted in a perpendicularly upward direction relativeto the light source 20, which allows for expansion of distribution oflight of each of the light source 20. The expanded light is irradiatedon the wall parts 13 and reflected, and thus difference in brightness ineach of the regions surrounded by the wall parts 13 can be reduced orsubstantially eliminated. As shown in FIG. 3B, the term “batwing lightdistribution” used herein can be defined as an emission intensitydistribution exhibiting stronger emission intensities at angles withabsolute values of light distribution angle greater than zero at 0°,with respect to the optical axis L at 0°. The optical axis L can begenerally defined as a line passing through the center of the lightsource and perpendicular to (a line in) the plane of the substrate.

The light source 20 configured to produce a batwing light distributionmay have a structure as shown in FIG. 3A, in which a light emittingelement 21 having a light-reflecting film 23 on its upper surface of thesemiconductor layered structure 22 is covered by a sealing member 24.The sealing member 24 may be formed after disposing the light sources 20on the substrate 10. The light-reflecting film 23 may be a metal film, adielectric multilayer film (DBR film), or the like, with either asingle-layer structure or a multilayer structure. Accordingly, light inupward direction emitted from the light emitting element 21 is reflectedat the light-reflecting film 23 such that the amount of light directlyabove the light emitting element 21 is reduced to produce a batwinglight distribution. The light-reflecting film 23 can be disposeddirectly on the upper surface of the light emitting element 21, whichcan eliminate the need for a batwing lens, thus allowing a reduction inthe thickness of the light source 20. For example, the height of thelight emitting elements 21 directly mounted on the substrate 10 can bein a range of 100 μm to 500 μm and the thickness of the light-reflectingfilm 23 can be in a range of 0.1 μm to 3.0 μm. Thus, even including thecovering member 24 to be discussed below, the thickness of the lightsource 20 can be in a range of about 0.5 mm to about 2.0 mm.

The light-reflecting film 23 preferably has an associated reflectivitythat exhibits angle dependence on the incidence angle to the emissionwavelength of the light emitting element 21. More specifically, thelight-reflecting film 23 is configured to have a smaller reflectance forobliquely incident light than that for perpendicularly incident light.With this arrangement, a gradual change in the luminance can be obtaineddirectly above the light emitting element 21 and accordingly, occurrenceof undesirable darker portion, such as occurrence of perceivably darkerportion directly above the light emitting element 21 can be prevented orreduced.

A plurality of light sources and a substrate to support the plurality ofthe light sources thereon are provided. The plurality of light sources20 are disposed on the substrate 10 as shown in FIG. 2B to provide thesubstrate 10 having the plurality of light sources disposed thereon(Step S1 in FIG. 1). The plurality of light sources 20 can be arrangedregularly in columns, in a matrix or the like, or randomly on thesubstrate 10. In particular, the plurality of light sources 20 arepreferably arranged in a two-dimensional array along two directions thatare perpendicular to each other, as the x-direction and the y-directionshown in FIG. 4A. The plurality of light sources 20 may be arranged atsubstantially equal intervals in the x-direction and the y-direction, orat different intervals in the x-direction and the y-direction. The lightsources 20 are preferably arranged on an upper surface of the substrateusing a bonding member. More specifically, as shown in FIG. 3A, then-side electrode and the p-side electrode of each of the light emittingelements 21 described above are arranged bridging the electricallyconductive wiring layers 12 disposed on the upper surface of thesubstrate 10, and then electrically connected thereto and through abonding member 14 and secured. That is, in the example illustrated inFIG. 3A, the light emitting element 21 is mounted on the substrate 10 byflip-chip bonding. The bonding member 14 preferably has electricallyconducting properties, and for example, a solder such as Sn—Bi-based,Sn—Cu-based, Sn—Ag-based, or Au—Sn-based, a eutectic alloy such as analloy having Au and Sn as its main components, an alloy having Au and Sias its main component, and an alloy having Au and Ge as its maincomponent, a brazing material of a low-melting-point metal, an adhesivemade of a combination of those, or the like may be employed. Suchmaterials can be appropriately selected according to the materials orthe like of the light source and the substrate. When the p-sideelectrode and the n-side electrode are electrically connected to theelectrically conductive wiring layer 12 through wires or the like, thebonding member 14 is provided to secure the regions of the lightemitting element 12, other than the p-side electrode and the n-sideelectrode, on the substrate, such that establishing electricalconnection between the light emitting element 21 and the electricallyconductive wiring layers 12 through the bonding member is not required.A light-reflecting underfill may be disposed between the substrate 10and the light emitting element 21, and a light-reflecting layer 13 a maybe disposed in a region of the electrically conductive wirings 12 toregions not to be used for establishing electrical connection. Thelight-reflecting layer 13 a can be disposed by using the materialsimilar to that used to form the wall parts 13.

The covering member 24 covers the light emitting element 21 and thelight-reflecting film 23 disposed on the light emitting element 21, andwith the light emitting element 21, the covering member 24 is held onthe substrate 10. Accordingly, the covering member 24 is preferablydisposed after the plurality of light sources 20 are disposed on thesubstrate 10. The sealing member 24 is configured to prevent or reducedamage of the light emitting element 21 caused by exposing the lateralsurfaces of the semiconductor layered structure 22, the light-reflectingfilm 23 or the like, to ambient environment. Examples of the materialsof the sealing member 24 include light-transmissive materials such asepoxy resin, silicone resin, resins which are mixtures of those, andglass. In view of light-resisting properties and ease of molding of thesealing member 24, silicone resin is preferably used.

The covering member 24 may include, for example, a light diffusingmaterial, a fluorescent material, and/or a coloring agent. Examples ofthe fluorescent material include a yttrium aluminum garnet (YAG)activated with cerium, a lutetium aluminum garnet (LAG) activated withcerium, a nitrogen-containing calcium aluminosilicate (CaO—Al₂O₃—SiO₂)activated with europium and/or chromium, a silicate ((Sr,Ba)₂SiO₄)activated with europium, α-sialon phosphor, and β-sialon phosphor.Examples of the fluorescent materials that can convert blue light intogreen light include β-sialon-based fluorescent material, and examples ofthe fluorescent materials that can convert blue light into red lightinclude fluoride-based fluorescent material such as KSF-basedfluorescent materials, or the like. When the sealing member 24 containsa β-sialon-based fluorescent material and a fluoride-based fluorescentmaterial such as a KSF-based fluorescent material, color reproductionrange of the light emitting device can be expanded. When the sealingmember 24 contains a fluorescent material, it is preferable to use thelight emitting element 21 having a nitride semiconductor(In_(X)Al_(Y)Ga_(1-X-Y)N, 0≤X, 0≤Y, X+Y≤1) to emit light of shorterwavelength that can efficiently excite the fluorescent material.

The covering member 24 can be disposed to cover the light emittingelement 21 and the light-reflecting film 23, by using a technique suchas compression molding, injection molding, printing, dispenser-deposit,or the like. In particular, the shape of the covering member 24 can becontrolled by optimizing the viscosity of a material of the coveringmember 24 and conducting dropping or drawing on the light emittingelement 21, then using the surface tension of the material. Thus, thesealing member 24 can be disposed through a simpler method, without aneed of a mold. The sealing member 24 can be formed in a shape, forexample, a substantially hemispherical shape, a bulging dome shape (aheight is larger than a lateral width) in a cross-sectional view, a flatdome shape (a lateral width is larger than a height) in across-sectional view, or a circular or elliptical shape in a top planview.

Other Component Members

Further, at least one selected from the group consisting of alight-diffusing plate, a wavelength-converting sheet, a prism sheet, anda polarizing sheet, discussed below, may be arranged above the pluralityof light sources.

Measuring First Light-Intensity Distribution

The plurality of light sources on the substrate are caused to emit light(Step S2 in FIG. 1) and a first light-intensity distribution is measuredas shown in FIG. 2C (Step S3 in FIG. 1). It is preferable that the firstlight-intensity distribution corresponds to a light-intensitydistribution of an entire plane located above the plurality of lightsources 20 and in parallel to the substrate 10. In order to obtain theabove, it is preferable that a position is set spaced apart from thesubstrate 10 at a predetermined distance, and an optical intensity overan entire plane in parallel to the substrate 10 is measured at theposition, either through a lens 27 or directly, using an optical devicesuch as a spectrometer, a photodetector, or the like. The data obtainedfrom the measurement can be processed through an information processingsystem 29 such as a computer to acquire measurement values. The firstlight-intensity distribution can be obtained by directly measuring lightemitted from the light sources 20, but it is preferable to measure thefirst light-intensity distribution through a light-diffusing plate 30, alight transmissive sheet, or the like, as a subject of disposing alight-reflecting pattern in a later step discussed below. With the firstlight-intensity distribution acquired by measuring a diffused state oflight obtained through the light-diffusing plate 30 or the like, unevendistribution of amount light can be further reduced or prevented, suchthat more uniform light intensity distribution within the plane becomespossible.

Light-Diffusing Plate 30

The light-diffusing plate 30 is configured to allow incident light totransmit therethrough while being diffused, and is preferably locatedabove the light sources 20. The light-diffusing plate 30 preferably hasa flat plate-shape, and an irregular structure may be provided on thesurface(s). The light-diffusing plate 30 is preferably locatedsubstantially in parallel to the substrate 10. The light-diffusing plate30 can be formed with a material that hardly absorb visible light, suchas polycarbonate resin, polystyrene resin, acrylic resin, polyethyleneresin, or the like. Providing an irregular structure on the surface(s)of the light-diffusing plate 30, or dispersing a material of differentrefractive index in the light-diffusing plate 30, allows for diffusinglight that enters the light-diffusing plate 30. The thickness of thelight-diffusing plate 30 and the degree of diffusion of light can beappropriately set, and a light-diffusing sheet, a light-diffusing film,or the like, a material available in the market can be employed. Such alight-transmissive sheet can be formed with a material exhibiting smallabsorption of visible light, particularly light emitted from the lightsources.

Forming Light-Reflecting Pattern

As shown in FIG. 2D, based on the measured value of the firstlight-intensity distribution, a light-reflecting pattern is disposedabove the plurality of light sources 20, to create a secondlight-intensity distribution that is different from the first-lightintensity distribution (Step S4 in FIG. 1). The unevenness in the firstlight intensity distribution has been compensated in the secondlight-intensity distribution, allowing for creating a light-intensitydistribution that has been intended or that is close to the intendedlight-intensity distribution. Accordingly, the second light-intensitydistribution corresponds to a light-intensity distribution of an entireplane located above the plurality of light sources 20 and in parallel tothe substrate 10. In the present specification, the term“light-reflecting pattern” refers to a pattern provided over an entiresurface of the substrate 10 having the plurality of light sources 20disposed thereon.

The light-reflecting pattern can be located at any appropriate locationabove the plurality of light sources, but, as shown in FIGS. 2E, 6, 12and 13, when one or more among the light-diffusing plate 30, thelight-transmissive sheet 31, the wavelength converting sheet 32, theprism sheet 33, 34, the polarizing sheet 35, a brightness enhancementfilm (BEF), a dual brightness enhancement film (DBEF), and the like, arelocated above the light sources as discussed above, the light-reflectingpattern can be disposed on a surface of one of those, which is eitherfacing or at the opposite side from the light sources. In particular,when the first light intensity distribution is measured through thelight-diffusing plate 30, the light-reflecting pattern is preferablydisposed on one surface of the light-diffusing plate 30 that is locatedopposite side from the light sources. Alternatively, in this case, thelight-transmissive sheet may be arranged below or above thelight-diffusing plate 30, above the plurality of light sources, and thelight-reflecting pattern may be formed on one surface of thelight-transmissive sheet. The one or more of the sheets discussed aboveare preferably directly stacked with each other, which allowsarrangement without insertion of the air (air layer) therebetween, andthus the return light is reduced. Accordingly, luminance of the lightemitting device can be improved.

The light-reflecting pattern can be formed with a material containing alight-reflecting material, such as a resin and/or an organic solvent,containing a light-reflecting material. Examples of light-reflectingmaterial include particles of metal oxide such as titanium oxide,aluminum oxide, and silicon oxide. The resin and the organic solvent canbe appropriately selected in view of the metal oxide particles andcharacteristics required for the light emitting device in itsapplication. A preferable resin can be a light-transmissive photocurableresin, mainly containing an acrylate resin, an epoxy resin, or the like.The material of the light-reflecting pattern may further contain, forexample, a pigment, a light-absorbing material, and/or a fluorescentmaterial.

The light-reflecting pattern can be formed by using any appropriatemethod known in the art, such as a printing method, an ink jet method,and a spray method. In one embodiment, as illustrated in FIG. 2D,charged droplets of material 43 a of the light-reflecting pattern aresprayed from a nozzle 42 of an ink jet printing device 41, the dropletsare polarized by an electric field controlled by command signalsgenerated from a control system 40 such as a computer, and adhered topredetermined locations on the surface of the light-diffusing plate 30.Thus, as illustrated in FIG. 2E, the light-reflecting pattern 43 ofpredetermined shapes can be formed. The light reflecting performance canbe appropriately adjusted by adjusting the concentration of thelight-reflecting material in the material of the light-reflectingpattern and/or by altering the thickness of the resin deposit. Thelight-reflecting pattern may be formed on the entire surface in a singlestep, or through a plurality of steps while maintaining or changing thematerial and/or the concentration of the material.

A predetermined light-reflecting pattern can be formed by, for example,adjusting the amount of the material of the light-reflecting patternor/and the thickness of the deposit material in a region exhibitingparticularly high light intensity in the first light-intensitydistribution. Accordingly, unevenness in the first light-intensitydistribution can be reduced, and the light-intensity of the entire planeabove the substrate 10 can be in the second light-intensity distributionexhibiting more uniform light-intensity distribution as a whole. Inother words, uneven distribution of amount of light within the planeassociated to light sources 20 due to individual differences in membersstructuring the light sources 20 is premeasured as the firstlight-intensity distribution, such that light intensity unfit to theintended second light-intensity distribution can be easily determinedaccording to the measured values. The light intensity to be complementedcan be recognized based on the determined result, such that forming thelight-reflecting pattern based on the determined result allows forachieving intended second light-intensity distribution with ease andreliably. The light-reflecting pattern can be formed for each substrateto be installed in a single light emitting device, at time subsequent todisposing of the light sources on the substrate or to disposing of thepredetermined member(s) described above, such that uneven lightintensity distribution (uneven luminance distribution) due to individualdifferences in the members can be corrected efficiently, in a simplifiedsteps and easily. Accordingly, mass production of high-quality lightemitting devices becomes possible.

More specifically, the method includes: (S1) providing the substrate 10having the wall parts 13 demarcating regions and the light sources 20each being disposed in a respective one of the regions surrounded by thewall parts 13 as shown in FIG. 4A; (S2) causing the light sources toemit light; (S3) measuring the first light intensity distribution; and(S4) the light-reflecting pattern is formed. As shown in FIG. 4B, thelight-reflecting pattern 43 is formed with altering the thickness and/orthe concentration of the material 43 a of the light-reflecting pattern43 mainly at regions A corresponding to a portion directly above andsurrounding each of the light sources 20, regions B corresponding to thewall parts 13 facing a respective one of the plurality of light sources20 and to portions surrounding the wall parts 13, and regions Ccorresponding to intersecting portions of adjacent wall parts 13 eachbeing a part of the wall parts 13 surrounding different regions and toportions surrounding the intersecting portions. In the embodimentillustrated in FIG. 4B, each of the regions A has a circular shape in aplan view, each of the regions B has a rectangular shape in a plan view,and each of the regions C has a cross shape in a plan view, whichcorresponds to intersecting portion of the wall parts 13. The boundaryportions of the regions of the light-reflecting pattern 43 may be formedwith an abrupt change in the thickness and/or the concentration of thematerial 43 a of the light-reflecting pattern 43, but preferably formedwith a gradual change in the thickness and/or the concentration of thematerial 43 a of the light-reflecting pattern 43. The thickness and/orthe concentration of the material 43 a of the light-reflecting pattern43 is greatest in the regions A, followed by the regions B, whereas thematerial 43 a of the light-shielding pattern 43 is not applied in theregions C.

For example, when the light emitting device includes seven of the lightsources 20 in each column and twenty of the light sources 20 in eachrow, and a light-reflecting pattern of that shown in FIG. 4B formedcorresponding to the light sources 20, more uniform distribution oflight in the plane can be achieved as shown in FIG. 5A, compared to thatof a light emitting device without provided with the light-reflectingpattern, for example, as shown in FIG. 5B. Further, at a predeterminedpoint in the plane (i.e., a point directly above a single light source20, further, a point directly above the light emitting element 21), theluminance intensity in a x-direction and in a y-direction respectivelyexhibits more uniform distribution of luminance intensity in the lightemitting device having the light-reflecting pattern according to thepresent embodiment as shown in FIG. 5A, compared to that of the lightemitting device that is not provided with the light-reflecting pattern,as shown in FIG. 5B. In the present embodiment, the light-reflectingpattern of the light emitting device is formed by using a printingmethod as described above, using a silicone resin solution containingtitanium oxide (titanium oxide:silicone resin=20:80 in weight ratio).Also, in the present embodiment, as shown in FIG. 6, the light emittingdevice includes an optical member located above the light sources 20disposed on the substrate 10. The optical member includes a layeredstructure, in which the light-reflecting pattern 43 is located on anupper surface of the light-diffusing plate 30, on which awavelength-converting sheet 32, a first prism sheet 33, a second prismsheet 34, and a polarizing sheet 35 describe above are located in thisorder. The distribution of light is measured from above the opticalmember.

In other embodiments, as shown in FIG. 7 and FIG. 8, the regionscorresponding to the region A, the regions corresponding to the regionsB, and the regions corresponding to the regions C can be arranged invarious shapes. Also, as shown in FIG. 9 to FIG. 11, the regionscorresponding to the regions A and the regions corresponding to theregions B may be arranged in various shapes whereas the regionscorresponding to the regions C are not provided.

In the method of manufacturing a light emitting device according tocertain embodiment of the present invention, successive to forming the(first) light-reflecting pattern (Step S4), the light intensitydistribution is measured through the light-reflecting pattern todetermine whether the light intensity distribution fits the intendedlight intensity distribution (Step S5), and if the light intensitydistribution is determined as uneven, a second light-reflecting patternmay be formed based on the measurement result of the light intensitydistribution (Step S4).

In the method of manufacturing a light emitting device according tocertain embodiment of the present invention, prior to or successive toforming the light-reflecting pattern, at least one selected from thegroup consisting of a wavelength-converting sheet, a prism sheet, and apolarizing sheet may be disposed above or under the light-reflectingpattern. For example, as shown in FIG. 6, the light-diffusing plate 30having the light-reflecting pattern 43 formed on its upper surface, thewavelength-converting sheet 32, the first prism sheet 33, the secondprism sheet 34, and the polarizing sheet 35 can be layered in this orderabove the light sources 20 disposed on the substrate 10.

Further, in the method according to certain embodiments of the presentinvention, successive to forming the light-reflecting pattern, with orwithout performing measuring in a similar manner as in measuring thefirst light intensity distribution, a color-converting pattern 36 (see,FIG. 13) based on the measurement result of the light intensitydistribution may be formed on, for example, one surface or above of oneof the sheets described above (e.g., on wavelength converting sheet 32as shown in FIG. 13), by using a resin and/or an organic solventcontaining a fluorescent material. In particular, in certain embodimentsusing a wavelength converting sheet, unevenness (particularly unevennessin the distribution of the color of light) after passing the wavelengthconverting sheet can be reduced by disposing the color-converting sheet.Alternatively, prior to forming the light-reflecting pattern, the firstlight intensity distribution is measured and based on the measurementresult, a color-converting pattern may be formed on one surface of oneof the sheets described above, by using a resin and/or an organicsolvent containing a fluorescent material. In this case, thelight-reflecting pattern is disposed on or above the color-convertingpattern, and the color-converting pattern and the light-reflectingpattern may be formed, for example, on one surface of a single sheet orone surface of different sheets.

Wavelength-Converting Sheet 32

The wavelength converting sheet 32 can be disposed on thelight-diffusing plate 30, either on the side facing the substrate 10 oropposite side from the substrate 10, but the opposite side ispreferable. The wavelength-converting sheet 32 is configured to absorb aportion of light emitted from the light sources 20 and emit light havinga wavelength different from the wavelength of light emitted from thelight sources 20. For example, the wavelength-converting sheet 32absorbs a portion of blue light emitted from the light sources 20 andemits yellow light, or the wavelength-converting sheet 32 absorbs aportion of blue light emitted from the light sources 20 and emits greenlight and red light. With the use of either of the wavelength convertingsheet 32 described above, a light source device to emit white light canbe obtained. The wavelength converting sheet 32 is located spaced apartfrom the light emitting elements 21 of the light sources 20, allowingfor use of a fluorescent material or the like, which is less resistantto light of high intensity and cannot be used near the light emittingelements 21. Accordingly, when the light source device is used as abacklight of a light emitting device, performance as a backlight in alight emitting device can be improved. The wavelength converting sheet32 has a sheet shape or a layer shape, and includes the fluorescentmaterial etc. described above.

First Prism Sheet 33 and Second Prism Sheet 34

The first prism sheet 33 and the second prism sheet 34 respectively hasa surface provided with a plurality of prisms extending in apredetermined direction. For example, the first prism sheet 33 has aplurality of prisms extending in the x-direction and the second prismsheet 34 has a plurality of prisms extending in the y-direction. Theprism sheets are configured such that light incident on the prism sheetfrom different directions is reflected in a direction toward a displaypanel that is facing the light emitting device. Accordingly, lightemitted from the light-emitting surface of the light emitting device canbe directed mainly in an upward direction perpendicular to the uppersurface of the light emitting device, such that the luminance viewedfrom the front of the light emitting device can be increased.

Polarizing Sheet 35

The polarizing sheet 35 can be configured, for example, to selectivelytransmit light traveling in the polarization direction of a polarizationplate that is located at a backlight side of a display panel, forexample, a liquid crystal display panel, and to reflect the polarizedlight traveling in a direction perpendicular to the polarizationdirection toward the first prism sheet 33 and the second prism sheet 34.Portions of light returned from the polarizing sheet 35 are reflectedagain at the first prism sheet 33, the second prism sheet 34, thewavelength converting sheet 32, and the light-diffusing plate 30. Atthis time, the polarization direction is changed and converted into, forexample, polarized light in polarization direction of the polarizationplate of a liquid crystal display panel, and the polarized light entersthe polarizing sheet 35 again and emitted toward the display panel.Accordingly, the polarization directions of light emitted from the lightemitting device can be aligned, such that light in the polarizationdirection effective for improving the luminance of the display panel canbe emitted with high efficiency. The polarizing sheet 35, the firstprism sheet 33, the second prism sheet 34, etc., that are commerciallyavailable as optical members for backlight can be employed.

It is to be understood that although the present invention has beendescribed with regard to preferred embodiments thereof, various otherembodiments and variants may occur to those skilled in the art, whichare within the scope and spirit of the invention, and such otherembodiments and variants are intended to be covered by the followingclaims.

What is claimed is:
 1. A method of manufacturing a light source device,the method comprising: providing a substrate having a plurality of lightsources disposed thereon; causing the plurality of light sources to emitlight; measuring a first light-intensity distribution of an entiresurface that is in parallel to the substrate and located above theplurality of light sources; and forming a light-reflecting pattern byapplying a reflecting material above the plurality of light sources suchthat a light-reflecting performance of the light-reflecting pattern isadjusted based on a measured value of the first light-intensitydistribution to obtain a second light-intensity distribution that isdifferent from the first light-intensity distribution.
 2. The method ofmanufacturing a light source device according to claim 1, furthercomprising arranging a light-diffusing plate above the plurality oflight sources, wherein the measuring of the first light-intensitydistribution includes measuring the first light-intensity distributionon the light-diffusing plate.
 3. The method of manufacturing a lightsource device according to claim 2, wherein the forming of thelight-reflecting pattern includes forming the light-reflecting patternon one surface of the light-diffusing plate.
 4. The method ofmanufacturing a light source device according to claim 3, wherein theforming of the light-reflecting pattern includes forming thelight-reflecting pattern using the reflecting material that contains alight-reflecting material made of metal oxide particles.
 5. The methodof manufacturing a light source device according to claim 3, wherein theproviding of the substrate includes providing the substrate having theplurality of light sources respectively including one or more lightemitting elements and a light-reflecting film disposed on an uppersurface of each of the one or more light emitting elements.
 6. Themethod of manufacturing a light source device according to claim 3,wherein the providing of the substrate includes providing the substratefurther having wall parts surrounding each of the plurality of lightsources.
 7. The method of manufacturing a light source device accordingto claim 3, further comprising arranging at least one selected from thegroup consisting of a wavelength-converting sheet, a prism sheet, and apolarizing sheet.
 8. The method of manufacturing a light source deviceaccording to claim 3, further comprising forming a color-convertingpattern above the light-reflecting pattern.
 9. The method ofmanufacturing a light source device according to claim 2, furthercomprising arranging a light-transmissive sheet above the plurality oflight sources, wherein the forming of the light-reflecting patternincludes forming the light-reflecting pattern on one surface of thelight-transmissive sheet.
 10. The method of manufacturing a light sourcedevice according to claim 9, wherein the forming the light-reflectingpattern includes forming the light-reflecting pattern using thereflecting material that contains a light-reflecting material made ofmetal oxide particles.
 11. The method of manufacturing a light sourcedevice according to claim 9, wherein the providing of the substrateincludes providing the substrate having the plurality of light sourcesrespectively including one or more light emitting elements and alight-reflecting film disposed on an upper surface of each of the one ormore light emitting elements.
 12. The method of manufacturing a lightsource device according to claim 9, wherein the providing of thesubstrate includes providing the substrate further having wall partssurrounding each of the plurality of light sources.
 13. The method ofmanufacturing a light source device according to claim 9, furthercomprising arranging at least one selected from the group consisting ofa wavelength-converting sheet, a prism sheet, and a polarizing sheet.14. The method of manufacturing a light source device according to claim9, further comprising forming a color-converting pattern above thelight-reflecting pattern.
 15. The method of manufacturing a light sourcedevice according to claim 1, further comprising arranging alight-transmissive sheet above the plurality of light sources, whereinthe forming of the light-reflecting pattern includes forming thelight-reflecting pattern on one surface of the light-transmissive sheet.16. The method of manufacturing a light source device according to claim1, wherein the forming of the light-reflecting pattern includes formingthe light-reflecting pattern using the reflecting material that containsa light-reflecting material made of metal oxide particles.
 17. Themethod of manufacturing a light source device according to claim 1,wherein the providing of the substrate includes providing the substratehaving the plurality of light sources respectively including one or morelight emitting elements and a light-reflecting film disposed on an uppersurface of each of the one or more light emitting elements.
 18. Themethod of manufacturing a light source device according to claim 1,wherein the providing of the substrate includes providing the substratefurther having wall parts surrounding each of the plurality of lightsources.
 19. The method of manufacturing a light source device accordingto claim 1, further comprising arranging at least one selected from thegroup consisting of a wavelength-converting sheet, a prism sheet, and apolarizing sheet above the plurality of light sources.
 20. The method ofmanufacturing a light source device according to claim 1, furthercomprising forming a color-converting pattern above the light-reflectingpattern.
 21. The method of manufacturing a light source device accordingto claim 1, wherein the light-reflecting performance of thelight-reflecting pattern is adjusted by adjusting a concentration of alight-reflecting material contained in the reflecting material.
 22. Themethod of manufacturing a light source device according to claim 1,wherein the light-reflecting performance of the light-reflecting patternis adjusted by altering a thickness of the reflecting material appliedabove the plurality of light sources.
 23. The method of manufacturing alight source device according to claim 1, wherein the forming of thelight-reflecting pattern includes forming the light-reflecting patternhaving first regions directly above the plurality of light sources,respectively, and a second region different from the first regions.